View TDA8446_190059.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TDA8446 Fast RGB/YC switch for digital decoding
Product specification Supersedes data of August 1992 File under Integrated Circuits, IC02 1995 Feb 16
Philips Semiconductors
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
FEATURES * R, G, B clamped inputs * Luminance and chrominance difference matrix * Y-clamped inputs * Fast switching between internal and external Y * Chrominance input * Amplifier with selectable gain * 3-state switch for chrominance output. APPLICATIONS * Digital TV systems * Desktop video architecture. QUICK REFERENCE DATA SYMBOL VCC Tamb supply voltage operating ambient temperature PARAMETER 0 MIN. 10.8 - - TYP. DESCRIPTION
TDA8446
The TDA8446 is a video switch which has been designed for use in Digital Multistandard System Decoders (DMSD) in digital video system. The device is intended for matrixing incoming RGB signals and for switching between luminance signals. It generates a SYNC signal and TTL clamping pulses from any video signal with sync pulses.
MAX. 13.2 +70 V
UNIT C
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8446 TDA8446T DIP20 SO28 DESCRIPTION plastic dual in-line package; 20 leads; (300 mil) plastic small outline package; 28 leads; body width 7.5 mm VERSION SOT146-1 SOT136-1
1995 Feb 16
2
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
BLOCK DIAGRAM
TDA8446
Fig.1 Block diagram (TDA8446).
1995 Feb 16
3
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
PINNING PIN SYMBOL DIP20 SOUT SIN CCL n.c. CLO n.c. BIN GIN RIN SW1 n.c. CLI CIN COUT YIN FS n.c. n.c. SW2 n.c. -(R-Y) YOUT -(B-Y) n.c. n.c. VCC VINT VEE 1 2 3 - 4 - 5 6 7 8 - 9 10 11 12 13 - - 14 - 15 16 17 - - 18 19 20 SO28 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 DESCRIPTION
TDA8446
synchronization signal output; this output provides the synchronization information extracted from the incoming signal at pin 2 (SIN). synchronization signal input; CSYNC or CVBS signal from the peri-connector clamping capacitor connection; the clamping pulse is generated by external circuitry connected to this pin, the generated pulse clamps the RGB inputs. not connected clamping pulse output not connected B-signal input G-signal input R-signal input clamping control signal input; this TTL signal is used to select the clamp signal, a LOW level at this input forces the circuit to output the generated clamping pulse. not connected clamping pulse input; this TTL signal indicates the black level clamping period for the incoming Y signal (active-HIGH). chrominance signal input chrominance signal output luminance signal input; this input also accepts the CVBS signal fast switching signal input; this signal is used to control fast switching of the luminance signals, a HIGH level at this input forces the circuit to output the internal Y signal. not connected not connected gain control signal input; this TTL signal is used to set the gain of the chrominance amplifiers (A), a LOW level at this input forces the gain A to 6 dB (HIGH forces to 0 dB). not connected -(R-Y) signal output luminance signal output -(B-Y) signal output not connected not connected positive supply voltage (+12 V) internal decoupling ground
1995 Feb 16
4
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
Fig.2 Pin configuration (DIP20).
Fig.3 Pin configuration (SO28).
1995 Feb 16
5
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC VI Tstg HANDLING supply voltage input voltage storage temperature PARAMETER MIN. -0.3 -0.3 -55
TDA8446
MAX. +14 +12.3 +125 V V
UNIT
C
Each pin will withstand the ESD test in accordance with MIL-STD-883C class 2 (2000 V to 2999 V). Method 3015 (Human body model: R = 1500 ; C = 100 pF) 3 pulses positive and 3 pulses negative on each pin as a function of ground. The IC will withstand 500 V in accordance with UZW-BO/FQ-B302 (Machine model: R = 0 ; C = 200 pF; L = 2.5 H) 3 pulses positive and 3 pulses negative. OPERATING CHARACTERISTICS SYMBOL Supply/temperature VCC Tamb VIH VIL VS(p-p) VIH VIL Vi(p-p) CI Rclamp Cclamp supply voltage operating ambient temperature 10.8 0 - - - - - - - 13.2 +70 V C PARAMETER MIN. TYP. MAX. UNIT
TTL inputs (SW1, SW2 and CLI) HIGH level input voltage LOW level input voltage 2 -0.3 VCC +0.8 V V
SYNC signal (SIN) sync amplitude (peak-to-peak value) 0.2 2.5 V
Fast Switching input (FS) HIGH level input voltage LOW level input voltage 1 0 - - - - 3 0.4 V V
Video inputs (RIN, GIN, BIN, CIN, YIN) video amplitude on RIN, GIN and BIN inputs (peak-to-peak value) input capacitance 0.7 100 1 - - - V nF
Clamping pulse generator (CCL) clamping resistance clamping capacitance 4.7 1 k nF
1995 Feb 16
6
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
CHARACTERISTICS VCC = 12 V; Tamb = 25 C; unless otherwise specified. SYMBOL Supply ICC SVRR supply current supply voltage rejection ratio note 1 - 30 - - - +0.5 0 6 0 PARAMETER CONDITIONS MIN. TYP.
TDA8446
MAX.
UNIT
75 - - +1.5 +1 7 +1
mA dB
Y and R, G, B channels ICL II GA GB input clamping current input current gain of amplifier A gain of amplifier B RGB matrixed according to the following equations: Y = 0.30R + 0.59G + 0.11B R-Y = 0.70R - 0.59G - 0.11B B-Y = -0.30R - 0.59G + 0.89B Gdiff |G| RO t VO tfsd tfs IIFS relative gain difference maximum gain variation output resistance time difference at output DC output level fast switching delay fast switching time input current on fast switching control (pin 13) fi = 1 MHz; note 3 VCCL = 6 V see Fig.4 see Fig.4 VI = 0.4 V VI = 1 V note 2 100 kHz < fi < 8 MHz - - - - - - - - - - II = 0 fi = 1 MHz; VSW1 = VSW2 = 2 V fi = 1 MHz; VSW2 = 0.8 V |G| off Zo Ro IIH IIL maximum gain variation isolation (off state) output impedance output resistance 100 kHz < fi < 8 MHz fi = 5 MHz; VSW1 = VSW2 = 0.8 V VSW1 = VSW2 = 0.8 V - -1 5 - - 100 - - - 0 3 15 - 4.2 20 10 0.7 0.5 10 - - 25 - - - - - - - +1 7 - - - - % dB ns V ns ns A A VCC = 6 V; VI = 0 V VI = 9 V fi = 1 MHz; VSW2 = 2 V fi = 1 MHz; VSW2 = 0.8 V fi = 1 MHz 0.3 -1.5 -1 5 -1 mA A dB dB dB
Chrominance channel (CIN, COUT) Ri VO GA internal input resistance DC output level gain of amplifier A 50 5 0 6 3 60 - 7 - - k V dB dB dB dB k A A
TTL inputs (SW1, SW2, CLI) HIGH level input current LOW level input current VIH = 2 V VIL = 0.8 V 10 -600
1995 Feb 16
7
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
SYMBOL Clamp output (CLO) VOL VOH Vo(p-p) Notes
PARAMETER
CONDITIONS
MIN. - 2.4
TYP. - - -
MAX.
UNIT
LOW level output voltage HIGH level output voltage
IOL = 2 mA IOH = 10 A
0.4 -
V V
Synchronization channel (SOUT) output amplitude (peak-to-peak value) 0.2 1.5 V
V R ( CC ) 1. Supply voltage rejection ratio = 20log ------------------VR ( O) 2. The relative gain difference is measured when only one input signal (R, G or B) is present. 3. The inputs RIN, GIN and BIN are interconnected; t is the maximum time coincidence error between the luminance and the chrominance signals.
Fig.4 Fast switching times.
1995 Feb 16
8
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
APPLICATION INFORMATION
TDA8446
Fig.5 Typical application circuit.
1995 Feb 16
9
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil)
TDA8446
SOT146-1
D
seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 7.62 0.30
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2.0 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-05-24
1995 Feb 16
10
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-24
1995 Feb 16
11
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s. Plastic small outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C.
TDA8446
A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.59+
1995 Feb 16
12
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8446
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1995 Feb 16
13
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
NOTES
TDA8446
1995 Feb 16
14
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
NOTES
TDA8446
1995 Feb 16
15
Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)821-2333, Fax. (011)829-1849 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (9)0-50261, Fax. (9)0-520971 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: P.O. Box 10 63 23, 20043 HAMBURG, Tel. (040)3296-0, Fax. (040)3296 213. Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Hong Kong: PHILIPS HONG KONG Ltd., 15/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T., Tel. (852)424 5121, Fax. (852)480 6960/480 6009 India: Philips INDIA Ltd, Shivsagar Estate, A Block , Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)640 000, Fax. (01)640 200 Italy: PHILIPS SEMICONDUCTORS S.r.l., Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5028, Fax. (03)3740 0580 Korea: (Republic of) Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB Tel. (040)783749, Fax. (040)788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546. Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366. Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494. Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382. Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319. Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 2770, Fax. (0212)282 6707 United Kingdom: Philips Semiconductors LTD., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD38 (c) Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/01/pp16 Document order number: Date of release: 1995 Feb 16 9397 750 00009
Philips Semiconductors

▲Up To Search▲

Price & Availability of TDA8446

	To Download TDA8446 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .